Nanoleakage, ultramorphological characteristics, and microtensile bond strengths of a new low-shrinkage composite to dentin after artificial aging
Abstract
Objectives
To study the microtensile bond strengths and nanoleakage of low-shrinkage composite to dentin. The null hypotheses tested were (1) aging does not affect the bonding of low-shrinkage composite; (2) there is no difference in microtensile bond strengths and nanoleakage using different bonding strategies.
Methods
32 extracted molars were assigned to one of four groups: LS System Adhesive (LS, 3M ESPE); dentin etched for 15
s with phosphoric acid
+
LS System Adhesive (LSpa); Adper Single Bond Plus (SB, 3M ESPE); SB
+
LS Bond (SBLS). Occlusal dentin was exposed and restored with Filtek LS (3M ESPE). The samples were tested after 24
h or after 20,000 thermocycles and 6 months of aging. Teeth were sectioned with a cross-section of 0.8
±
0.2
mm2 and fractured at a crosshead speed of 1
mm/min. The data were submitted to ANOVA/Duncan's post hoc test, at p
<
0.05. Five slabs from each group were selected and immersed in 50
wt% ammoniacal silver nitrate. Then, specimens were processed for SEM, the silver penetration was measured and data analyzed with Kruskal–Wallis at p
<
0.05.
Results
No statistically significant difference was found among the experimental groups for the factor dentin treatment (p
=
0.165) and aging (p
=
0.091). All experimental groups exhibit some degree of nanoleakage. There was no adhesion of Filtek LS applied directly over dentin surfaces treated with SB.
Significance
The new low-shrinkage resin composite showed compatibility only with its dedicated adhesive. Pre-etching did not improve the bond strengths to low-shrinkage resin composite. Some degree of nanoleakage was evident in all groups.
Keywords: Microtensile bond strengths, Nanoleakage, Dentin adhesion, Hybrid layer thickness, Aging, Silorane, Scanning electron microscopy
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PII: S0109-5641(08)00264-9
doi:10.1016/j.dental.2008.10.012
© 2008 Academy of Dental Materials. Published by Elsevier Inc. All rights reserved.
