Bond angle effects on microtensile bonds: Laboratory and FEA comparison

Silva, Nelson R.F.A.; Calamia, Christine S.; Harsono, Masly; Carvalho, Ricardo M.; Pegoraro, Luiz F.; Fernandes, Carlos A.O.; Vieira, Antonio C.B.; Thompson, Van P.

doi:10.1016/j.dental.2005.05.006

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Volume 22, Issue 4 , Pages 314-324, April 2006

Bond angle effects on microtensile bonds: Laboratory and FEA comparison

Nelson R.F.A. Silva
- Department of Biomaterials and Biomimetics, Department of Prosthodontics, New York University, College of Dentistry, 345 East 24th Street, Room 804, New York City, NY, 10010, USA
Christine S. Calamia
- Department of Biomaterials and Biomimetics, Department of Prosthodontics, New York University, College of Dentistry, 345 East 24th Street, Room 804, New York City, NY, 10010, USA
Masly Harsono
- Department of Biomaterials and Biomimetics, Department of Prosthodontics, New York University, College of Dentistry, 345 East 24th Street, Room 804, New York City, NY, 10010, USA
Ricardo M. Carvalho
- Department of Operative Dentistry, Bauru School of Dentistry, SP, Brazil
Luiz F. Pegoraro
- Department of Prosthodontics, Bauru School of Dentistry, SP, Brazil
Carlos A.O. Fernandes
- Department of Operative Dentistry, Federal University of Ceara, CE, Brazil
Antonio C.B. Vieira
- School of Engineering, University of Minas Gerais, MG, Brazil
Van P. Thompson
- Department of Biomaterials and Biomimetics, Department of Prosthodontics, New York University, College of Dentistry, 345 East 24th Street, Room 804, New York City, NY, 10010, USA
- Corresponding author. Tel.: +1 212 9989938; fax: +1 212 995 4244.

Received 6 July 2004; received in revised form 7 April 2005; accepted 12 May 2005.

Summary

Objective

To test the hypothesis that there is a reduction in bond strength when a microtensile load is applied to adhesive junctions prepared at 10, 20 and 30 degrees to the usual perpendicular interface. To evaluate the effect of bond angle and adhesive layer thickness on stress levels within the adhesive joint utilizing FEA.

Methods

Twenty-four non-carious third molars were selected, occlusal enamel removed and polished perpendicular to the long axis of the tooth. The Clearfil SE Bond and Single Bond were applied on the dentin. A 4mm resin restoration, Z 100, was built up. The teeth were sectioned at 10°, 20° and 30° to the bonding interface (n=3). The control (n=3) group had all cuts parallel to the tooth longitudinal axis (0° bond angle). The bond values were calculated in MPa and Two-Way ANOVA and Tukey test applied. FEA was performed (1mm/side square specimens) to obtain the maximum principal stress (MPS) in the microtensile-model for each bond angle and for varying adhesive thickness from 20μm to 200μm for each group.

Results

The bond strength results diminish as the angle on the interface increased (P<0.05) for Clearfil SE Bond between 0 (control) and 30 degrees, and for Single Bond between 0 (control) and 10, 20, and 30 degrees. The hypothesis can be fully accepted for Single Bond and partially accepted for Clearfil SE Bond. For the FEA, there was a trend toward decreasing MPS as the bond angle increased, while the MPS for each angled group increased with adhesive layer thickness.

Significance

The MPS results for angled interfaces, exhibited the same trend as the lab values. FEA results indicated an MPS increase with increased adhesive thickness.

Keywords: FEA, Angled interface, Microtensile, Bond strength

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PII: S0109-5641(05)00177-6

doi:10.1016/j.dental.2005.05.006

Refers to corrigendum:

Corrigendum to: “Bond angle effects on microtensile bonds: Laboratory and FEA comparison” [Dental Materials 22 (2006) 314–324]
Nelson R.F.A. Silva, Christine S. Calamia, Masly Harsono, Ricardo M. Carvalho, Luiz F. Pegoraro, Carlos A.O. Fernandes, Antonio C.B. Vieira, Van P. Thompson
Dental Materials February 2008 (Vol. 24, Issue 2, Page 288)
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